彩神争8手机版官网-高端PCB研发制造
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                  ◆常规制造能力

                   

                  序号No

                  项目Item

                  技术能力参数Process capability parameter

                  1

                  基材

                  Base material

                  FR-4High TgHalogen-freePTFECeramic PCBPolyimide

                  2

                  印制板类型

                  PCB type

                  PCBFPCR-FPCHDI

                  3

                  最高层次

                  Max layer count

                  64

                  64 layers

                  4

                  最小基铜厚

                  Min base copper thickness

                  1/3 OZ 12um

                  5

                  最大完成铜厚

                  Max finished copper thickness

                  6 OZ

                  6

                  最小线宽/间距

                  Min trace width/spacing

                  内层

                  Inner layer

                  2/2mil H/H OZ base copper

                  7

                  外层

                  Outer layer

                  2.5/2.5mil H/H OZ  base copper

                  8

                  孔到内层导体最小间距

                  Min spacing between hole to inner layer conductor

                  6mil

                  9

                  孔到外层导体最小间距

                  Min spacing between hole to outer layer conductor

                  6mil

                  10

                  最小过孔焊环

                  Min annular ring for via

                  3mil

                  11

                  最小元件孔焊环

                  Min annular ring for component hole

                  5mil

                  12

                  最小BGA焊盘

                  Min BGA diameter

                  8mil

                  13

                  最小BGA Pitch

                  Min BGA pitch

                  0.4mm

                  14

                  最小成品孔径

                  Min hole size

                  0.15mmCNC)|0.1mmLaser

                  15

                  最大板厚孔径比

                  Max aspect ratios

                  20:1

                  16

                  最小阻焊桥宽

                  Min soldermask bridge width

                  3mil

                  17

                  阻焊/线路加工方式

                  Soldermask/circuit processing method

                  菲林|激光直接成像

                  FilmLDI

                  18

                  最小绝缘层厚

                  Min thickness for insulating layer

                  2mil

                  19

                  HDI及特种板

                  HDI & special type PCB

                  HDI1-3 steps)|R-FPC2-16 layers)|High frequency mix-pressing2-14 layers)|Buried capacitance & resistance ……

                  20

                  表面处理类型

                  Surface treatment type

                  化学沉金|有铅/无铅喷锡|OSP|沉锡|沉银|镀厚金|镀银

                  ENIGHALHAL lead freeOSPImmersion SnImmersion silverPlating hard goldPlating silver

                  201

                  最大加工尺寸

                  Max PCB size

                  609*889mm

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                  0755-27820302

                   
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